JPH0335065U - - Google Patents
Info
- Publication number
- JPH0335065U JPH0335065U JP9595189U JP9595189U JPH0335065U JP H0335065 U JPH0335065 U JP H0335065U JP 9595189 U JP9595189 U JP 9595189U JP 9595189 U JP9595189 U JP 9595189U JP H0335065 U JPH0335065 U JP H0335065U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- lead wires
- electronic component
- electronic
- constructed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9595189U JPH0335065U (en]) | 1989-08-16 | 1989-08-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9595189U JPH0335065U (en]) | 1989-08-16 | 1989-08-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0335065U true JPH0335065U (en]) | 1991-04-05 |
Family
ID=31645182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9595189U Pending JPH0335065U (en]) | 1989-08-16 | 1989-08-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0335065U (en]) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63110168A (ja) * | 1986-10-25 | 1988-05-14 | 松下電器産業株式会社 | Ｓｉｐ形電子部品のテ−ピング方法 |
-
1989
- 1989-08-16 JP JP9595189U patent/JPH0335065U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63110168A (ja) * | 1986-10-25 | 1988-05-14 | 松下電器産業株式会社 | Ｓｉｐ形電子部品のテ−ピング方法 |
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